BASE PASSIVE PIC
The MPW Base Passive PIC consists of one silicon and two silicon nitride waveguides. A trench is available to remove most of cladding oxide over the first nitride waveguide.
On the base passive PIC build build, silicon waveguide propagation loss target is 0.75 dB/cm while the silicon nitride waveguide propagation loss target is 0.5 dB/cm.
Lower loss waveguides are available with our other offerings.
Design Information
The Base Passive PIC is supported by component libraries from Analog Photonics (APSUNY), Spark Photonics, the Research Foundation for SUNY (RFS) and Dream Photonics.
The APSUNY library is a comprehensive, high performance, black box library focused on operation in the O, C, and L bands.
The Spark library features waveguides, input couplers, MMIs, and more focused on operation from 700-1300nm.
The RFS library includes basic passive components such as input couplers, power taps, and splitters.
The Dream Photonics library supports many waveguide geometries and also includes couplers, splitters, thermal phase shifters, and optical attenuators and detectors.
Customization Available
Adjust ridge depth
Adjust waveguide thicknesses
Adjust vertical spacing between waveguides
Trench to the Si waveguide
Fully expose Si or SiN waveguide in the bottom of a trench
While MPWs typically follow a standard process flow that designers cannot modify, AIM Photonics has developed a “bite-size” custom offering where designers can make minor changes to the process flow for an additional fee. This is not a full custom run, and the modification must be something the fab team can execute without development work.
The fee for custom options typically varies between $10,000 - $50,000 depending on exactly what customization(s) are desired.
Please contact us well in advance of the design due date to ensure the fab team understands your request and can properly quote the work.
See also information about the MPW services agreement.
Schedule
Year | Run ID | Design Due Date |
Expected Ship Date |
---|---|---|---|
2023 | PAS 23-04P | Dec 4, 2023 | Mar 3, 2024 |
2024 | PAS 24-01P | Mar 4, 2024 | Jun 3, 2024 |
PAS 24-02P | Jun 3, 2024 | Sep 2, 2024 | |
PAS 24-03P | Sep 3, 2024 | Dec 2, 2024 | |
PAS 24-04P | Dec 2, 2024 | Mar 1, 2025 |
Pricing
Passive PIC Offerings |
Member (per 20 qty chips) |
Non-Member (per 20 qty chips) |
---|---|---|
25 mm2 | $22,000 | $26,400 |
50 mm2 | $33,000 | $39,600 |
100 mm2 | $44,000 | $52,800 |
Notes
Start dates for runs are subject to change.
Member Prices shown are for customers who are Full Active Members and have executed an AIM Photonics Membership Agreement.
Customer receives 20 qty unpackaged chips of the size/technology ordered.
All chips are placed in a gel-pack and shipped to the customer as part of Standard MPW Offerings pricing.
For an additional charge, sub-dicing or post processing is available – please see information about Testing, Assembly and Packaging (TAP) Services.
All pricing shown subject to change