TECHNOLOGY FOCUS
Our key technology focus areas
Telecom/Datacom
Initiative focuses on the challenges for manufacturing high-volume, low- cost Terabit-scale photonic interconnectivity technology for advanced high-performance embedded computing and data centers. Initial focus is on ultra-high-speed, high-quality multi-wavelength communications links exceeding Tb/s bandwidth densities; and multi-port (high-readix) spatial and wavelength selective, nanosecond-scale reconfigurable switches
RF Analog Applications
Initiative objective is to develop manufacturing technologies specifically targeted for producing high-volume chip-scale microwave photonics for demanding applications requiring very high optical performance fidelity. The driving goal is to address the critical challenges for the mass manufacture capable integration of high-dynamic range ultra-low loss broadband PICs and transmission communication performance.
PIC Sensors
Initiative addresses the manufacturing challenges of chemical and biochemical sensors realized in glass/silicon materials, and demonstrates how the proposed solutions can facilitate high-volume production of embedded sensors connecting to or integrated with mobile platforms. Goals include development and demonstration of manufacturing methods enabling dramatic miniaturization of sensor systems based on glass/silicon integrated photonics and novel engineered glass surfaces.
PIC Array Technologies
Initiative addresses the manufacturing challenges associated with PIC Phased Arrays. The primary focus of this effort will be on chip-based light distance and ranging (LIDAR). Phased arrays enable high-speed steered projection and imaging without moving parts. Applications extend to LIDAR, biomedical imaging, free-space communications and display technologies
Our centers for manufacturing innovation
Electronic Photonic Design Automation (EPDA)
Development of a set of integrated design tools for photonic and combined electronic-photonic components. Features: Models for Si and InP devices; integrated electronic-photonic design environment; design tools/process design kit (PDK); and intellectual property protection.
Multi Project Wafer/Assembly (MPWA)
Provision of full MPWA services including foundry broker and foundry operations for both Si and InP-based photonic devices and components. Features: Availability of in-house 300mm Si and InP fabrication facilities; III-V laser integration; Interposer 2.5D/3D integration; and integrated inline and optical test.
Inline Control and Test (ICT)
Robust optical testing for photonics applications using inline and stand-alone approaches. Features: high-throughput, high-functionality wafer-scale optical probe test; on-wafer photonic test cells for process control; and multi-channel I/O fiber array test interfaces.
Test, Assembly and Optical Packaging (TAP)
Development of standardized advanced automated, no-touch and accessible processes for PIC test, assembly and optical packaging. Features: suite of 2D, 2,5D and 3D automated optical element align on interposer, fiber/WG attach, and pick and place capabilities; sub-micron 3D inspection tools; and in-house prototype photonics optical packaging center.