Advanced Packaging Options

An Online Seminar
June 27, 2022 | 1:00 p.m. EDT

As the industry enters the new era of heterogeneous integration, advanced packaging in the form of chiplets is becoming increasingly important. A chiplet is not a package, but it is a new approach to system, package, and chip design. There are many package options that can be adopted and careful consideration is required to select the most appropriate options for the application.

Join us for this online seminar as E. Jan Vardaman, President and Founder of TechSearch International, examines the advantages and challenges of the emerging 3DIC format, laminate substrate format, fan-out on substrate (RDL) format, silicon interposer, and glass substrates. Drivers and tradeoffs for each package option will also be discussed.

Registration

This online seminar is open to the public, however you must register to receive login information. Please use your organization’s email address when registering, if possible.

About the Presenter

E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987. She is the author of numerous publications on emerging trends in semiconductor packaging and assembly. She is a senior member of IEEE EPS and is an IEEE EPS Distinguished Lecturer. She received the IMAPS GBC Partnership award in 2012, the Daniel C. Hughes, Jr. Memorial Award in 2018, the Sidney J. Stein International Award in 2019, and she is an IMAPS Fellow. She is a member of MEPTEC, SMTA, and SEMI. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.