TAP Tool Levels

Level 1 Tools

Metrology & Test

  • Sputter Prep for SEM

  • Polishing Setup (SEM Cross-Section)

  • Thermal Microscope

  • Reflectance Spectrometer (Thickness Measurement)

  • Diff Scanning Calorimetry

  • Confocal Scanning Acoustic Microscope

  • Laser Confocal Microscope

  • NIR Microscope

  • Spectroscopic Ellipsometer

  • Optical Backscatter Interferometer

  • Optical Vector Analyzer

  • UV/Vis Spectrophotometer

  • EO Test Instruments - General

Assembly

  • General Support Tools

  • Interferometer (Connected Fibers)

  • Fiber Prep and Fusion Splice

  • Die Pick and Place

  • Fiber Taper Manufacturing

  • Automated N2 Oven

Wafer Processing

  • Film Laminator

  • Plasma Ash

  • Tape Frame Applicator 300mm

  • Laser Die Marker

  • Reflow Tool

Level 2 Tools

Metrology & Test

  • X-ray Tomography

  • EO Test Instruments - High Speed

Assembly

  • Adhesive Dispenser

  • Large Bake Oven

  • High Volume Wire Bonder (requires tooling)

  • Mechanical Dicing Saw

Wafer Processing

  • Laser Dicing

  • Single Wafer flux cleaner

  • Coater/Developer

  • Wet Metal Etch and PR strip

Level 3 Tools

Metrology & Test

  • SEM/Dual-Beam

  • Wafer/Die Prober (Optoelectronic test)

Assembly

  • Laser Fiber Cleaver

  • Atmospheric Plasma Cleaner

  • Flip Chip

  • Semi-Automated Wire Bonder (prototype)

  • Chip Level Fiber Attach System

  • Solder Ball Jetter

Wafer Processing

  • Plasma Dicing

  • Lithography Exposure

  • PVD/Sputtering