TAP Tool Levels
Level 1 Tools
Metrology & Test
Sputter Prep for SEM
Polishing Setup (SEM Cross-Section)
Thermal Microscope
Reflectance Spectrometer (Thickness Measurement)
Diff Scanning Calorimetry
Confocal Scanning Acoustic Microscope
Laser Confocal Microscope
NIR Microscope
Spectroscopic Ellipsometer
Optical Backscatter Interferometer
Optical Vector Analyzer
UV/Vis Spectrophotometer
EO Test Instruments - General
Assembly
General Support Tools
Interferometer (Connected Fibers)
Fiber Prep and Fusion Splice
Die Pick and Place
Fiber Taper Manufacturing
Automated N2 Oven
Wafer Processing
Film Laminator
Plasma Ash
Tape Frame Applicator 300mm
Laser Die Marker
Reflow Tool
Level 2 Tools
Metrology & Test
X-ray Tomography
EO Test Instruments - High Speed
Assembly
Adhesive Dispenser
Large Bake Oven
High Volume Wire Bonder (requires tooling)
Mechanical Dicing Saw
Wafer Processing
Laser Dicing
Single Wafer flux cleaner
Coater/Developer
Wet Metal Etch and PR strip
Level 3 Tools
Metrology & Test
SEM/Dual-Beam
Wafer/Die Prober (Optoelectronic test)
Assembly
Laser Fiber Cleaver
Atmospheric Plasma Cleaner
Flip Chip
Semi-Automated Wire Bonder (prototype)
Chip Level Fiber Attach System
Solder Ball Jetter
Wafer Processing
Plasma Dicing
Lithography Exposure
PVD/Sputtering