AIM Photonics at ECTC
Join us as experts from AIM Photonics will share some of the Institute’s recent technology advancements in silicon photonics at the 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) in Orlando, Florida on May 30 thru June 2.
Be sure to stop by our exhibit booth (#114) where members of our technical staff will be available throughout the conference to show you how AIM Photonics can help advance your company’s innovative ideas into manufacturing-ready prototypes using our design enablement, multi-project wafer and electronic-photonic test, assembly and packaging services.
New! AIM Photonics’ Opto-electronic Testing Services
Find out about our new Opto-electronic Testing Services, featuring a full suite of advanced tools for testing both photonic integrated circuits (PICs) as well as conventional electronic ICs. With over 30 tools for passive optical, active optoelectronic, telecom/datacom, and RF and DC testing, our comprehensive toolset expands access to companies of all sizes to advanced testing capabilities for their prototype development without having to invest in testing infrastructure.
Wednesday, May 31 (9AM – 6:30PM) and Thursday, June 1 (9AM – 4PM)
Coquina Ballroom, Exhibit Booth #114
AIM Photonics Demonstration of a 300mm Si Photonics Interposer
Advances in silicon photonics performance and capability have led to increasing interest in research and commercialization of silicon photonics-based products. Silicon photonics has the potential to enhance and enable new applications of traditional electronic integrated circuits. In particular, there is a concerted effort in datacom applications, where silicon photonics is perfectly suited because of its low-cost, low-power, and high-bandwidth capabilities.
Future co-packaged optical datacom transceivers will require advanced 3D packaging technologies to achieve higher bandwidth, lower power and a smaller footprint. AIM Photonics is developing a Si photonic interposer platform (active interposer) to enable 3D co-packaged optics, which includes a 100 µm Si interposer built on a 300 mm Si wafer with in-situ photonic layers that support a full suite of active and passive components, including low-loss Si and SiN waveguides, edge couplers, photodetectors and modulators.
Join us as AIM Photonics Integration Engineer Seth Kruger presents the latest results on the institute’s 300 mm Si photonics interposer platform, including the challenges associated with the 3D assembly and packaging, as well as optical and electrical device performance data.
Wednesday, May 31 | 11:55 AM
Mediterranean 7 & 8
Additively Manufactured Electronics for Heterogenous Integration
This HIR workshop session will focus on the application of additive manufacturing engineering (AME) for heterogeneous integration, highlighting the benefits of AME methods, recent AME science and technology advances, promising AME applications, and growth areas requisite for electronics industry adoption.
In this session, AIM Photonics Director of Package Integration Annette Teng will address additive manufacturing in photonic packaging, specifically photonic wirebonding.
Tuesday, May 30 | 3:00-4:30 PM
Palazzo E Conference Room