Three days of hands-on activities at AIM Photonics’ Test, Assembly, and Packaging Facility, University of Rochester, and Rochester Institute of Technology teaches participants how to test, analyze, and package photonic integrated circuits (PICs).

Course attendees will learn:

• Passive PIC Testing – Coupling/alignment, waveguide loss, and interference

• Active PIC Testing – Modulation (Mach-Zehnder and ring resonator) and photodetection

• Packaging – Dicing, die bonding, wire bonding, fiber attach (using both traditional and photonic wire bonding technology), and metrology

Participants will use the AIM Photonics’ Hands on Photonic Education (HOPE) Datacom Kit, a six-chip photonic integrated chip (PIC) kit focused on the fundamental concepts used in data communications.