ANALOG PHOTONICS ELECTRONIC INTERPOSER COMPONENT LIBRARY
Features
Comprehensive instructions on how to best utilize the platform and components
50Ω transmission lines on various metal layers for high-speed RF routing throughout interposer
Pads for probing electrical signals for debugging during characterization
2.5D integration of PICs and ASICs onto electronic interposer with copper pillars
Connection of electronic interposer to PCB through ball grid array (BGA)
Passive electronic components for on-chip bias-tees and other analog applications
| Components | Qty | Performance |
|---|---|---|
| Transmission Line | 4 | 50Ω Impedance |
| Probe Pads | 2 | Microprobe Compatible |
| Copper Pillar Receive Pad | 1 | ˜60µm Pitch |
| Ball Grid Array Pad | 1 | ˜0.8mm Pitch |
| Inductor | 1 | 225pH |
| Capacitor | 1 | 350fF |
More Info