TEST, ASSEMBLY AND PACKAGING
AIM Photonics’ TAP facility is the nation’s first accessible 300 mm state-of-the-art facility for integrated silicon photonics test, assembly, and packaging.
Our development and production process capabilities in wafer-scale, chip-scale and I/O attach also include advanced test and metrology capabilities for each of these key functions.
We work closely with the AIM Photonics Multi-Project Wafer team at the Albany NanoTech Complex to help you design, build and package your photonic integrated circuit prototypes. In addition, we also provide test, assembly and packaging services for customer-provided chips and wafers.
Our extensive toolset offers advanced capabilities for fiber attach, heterogeneous integration, and metrology and testing of photonic and electronic devices. This—combined with our deep industry expertise—uniquely positions us to provide individualized service to meet our customers’ needs. Whether your job consists of a single device or multiple wafers, we’re ready to help with your prototype development, test and metrology requirements.
We offer a flexible pricing structure, including hourly, project-based, and collaborative partnership options. Contact us today for more information.
Contact Us
Chris Striemer
Director of Test, Assembly and Packaging Operations
cstriemer@aimphotonics.com
Our Services
Assembly and Packaging
Fiber Attach - single mode fiber, fiber arrays, PM fiber and active alignment
Flip Chip (photonic and electronic) - thermal, sonic and compression and placement within 0.5 µm tolerance
Wafer Probing - optical/RF/DC
Dicing - standard thickness wafers 775 µm, thin wafers ~100 µm, dicing street ≥ 100 µm mechanical and ~10-15 µm plasma and laser
Die Attach - conductive and/or non-conductive adhesives
Wire Bonding - ~100 µm pitch with 1 mil wire and ~150 µm pitch with 2 mil wire
Metallization - plating: Cu, SnAg, Pd, Ni, Au and sputtering: Ti, TiW, Cu, NiV, Ni
Bumping - depending on aspect ratio, >75 µm pitch; <75 µm is on the roadmap
Heterogeneous Integration
Electronic Photonic Interposers - Silicon chip carriers and full interposers with TSVs
Wafer-to-Wafer Bonding - Oxide fusion bonding, hybrid bonding, temporary bonding
Opto-Electronic Test
Passive Optical - insertion loss, propagation loss, spectral, group index/velocity
Active Optoelectronic - modulation (Vπ L), detector responsivity, laser LIV
Telecom/Datacom - eye-diagram, optical modulator and photodiode bit error rate testing
RF - S-parameters, detector bandwidth
DC - DC IV, leakage current measurements using a multi-contact DC probes
Metrology
Ellipsometry
Reflectrometry
Spectroscopy
Profilometry
SEM
X-Ray
IR
Acoustic microscopy